Conductive adhesives and thermal interface materials from KAGER for advanced electronics assembly
In modern electronics and microelectronics manufacturing, bonding is increasingly replacing soldering. Especially for temperature-sensitive components, electrically conductive adhesives offer clear advantages: low curing temperatures, mechanical flexibility, and long-term reliability under vibration and thermal stress.
Advantages of conductive adhesives
Conductive bonding enables electrical, thermal, and mechanical connections without exposing components to high soldering temperatures. Typical benefits include:
- protection of sensitive substrates
- suitability for microelectronics and sensors
- excellent performance in high-temperature environments
- vibration-resistant connections
High-temperature conductive adhesive Pyro-Duct 597 A
The silver-filled Pyro-Duct 597 A is a high-performance conductive adhesive featuring:
- electrical resistance: 0.0002 Ω/cm
- operating range: –55 °C to +927 °C
- single-component system without organic resins or solvents
- two-stage curing process
It is widely used for wire and wafer bonding in extreme thermal applications. The matching conductive coating Pyro-Duct 597 C is also available.
Cost-efficient conductivity with nickel: Pyro-Duct 598 A/C
The Pyro-Duct 598 A/C epoxy adhesive uses nickel flakes instead of precious metals, delivering excellent electro-thermal performance at lower cost:
- temperature resistance up to 538 °C
- thermal conductivity: 2.6 W/m·K
- volume resistivity: < 0.005 Ω/cm
Applications include solar cell assemblies, high-temperature sensors, and electronic circuits.
Thermal grease for optimized heat dissipation
Efficient thermal management is essential in electronic assemblies. The Heat-Away 641 thermal compound offers:
- high thermal and electrical conductivity
- temperature range: –51 °C to +290 °C
- easy application by brush
Expert consultation included
KAGER provides free technical consultation to support customers in selecting and applying conductive adhesives and thermal interface materials.
Learn more about Conductive and Form-Fit Connections Without Soldering
